The procedure turned out to be quite simple because the Ryzen 5 7400F has an IHS cover that is not soldered to the chips, as in the case of older models in the line, but is in contact with the silicon crystals (CCD and I/O die) through a heat-conducting paste. This method obviously reduces the overall cost of manufacturing a CPU, but usually makes heat transfer more difficult. How significant the difference will be, and whether it will become a problem for efficient chip cooling, will be determined later.
As a reminder, Ryzen 5 7400F belongs to the Raphael processor family and has 6 Zen 4 computing cores with support for multi-threading technology. The operating frequency of the novelty is 3.7/4.7 GHz, and the L3 cache capacity is 32 MB. The chip supports PCI-E 5.0 and has a TDP of 65W. The difference from the popular Ryzen 5 7500F (6/12; 3.7/5.0 GHz) is actually a lower maximum acceleration frequency, and, as it turned out, the use of thermal paste instead of solder.
Despite the recent announcement, the first Ryzen 5 7400F processors are already in Ukraine. With a starting price of ~6600 UAH ($157) for tray delivery, such an offer can hardly count on success. The older Ryzen 5 7500F model is now only slightly more expensive. So, we are waiting for the Ryzen 5 7400F to become more widely available and for its initial price to drop. The use of thermal paste for this model is an unpleasant feature, which, however, may not be critical in this case. However, the attractive price may well attract the attention of budget-conscious users who have been waiting for affordable AM5 chips to appear.